Showing results: 241 - 255 of 278 items found.
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Aldec, Inc.
TySOM™ is a family of embedded system prototyping boards. Depending on the board, one of three FPGAs will be at its heart: a Xilinx Zynq® UltraScale+™, a Xilinx Xilinx Zynq-7000 or a Microchip PolarFire SoC. The boards are compatible, through industry standard interfaces (FMC or BPX), with Aldec’s wide range daughter cards, making Aldec’s TySOM embedded prototyping boards ideal for the rapid development of applications that include automotive (and ADAS, in particular), artificial intelligence (AI), machine learning (ML), embedded vision, embedded-HPC (including edge-processing), IoT, IIoT and industrial automation.
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Sapphire 1.3M -
Teledyne e2v
This 1.3 million pixel Sapphire CMOS image sensor, designed on Teledyne e2v’s proprietary Eye-On-Si CMOS imaging technology, is ideal for diverse applications where superior performance is required. The innovative pixel design offers excellent performance in low-light conditions with both electronic rolling shutter and electronic global shutter, with a high-readout speed of 60 fps in full resolution. Novel industrial machine vision application features such as multi ROI and histogram output are embedded on-chip. Very low power consumption enables this device to be used in battery powered applications.
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Ceres V 640 Series -
Xenics
The Ceres V 640 series is based upon the Dione 640 OEM thermal imaging core with 640×480 pixels and 12 µm pixel pitch and NETD of less than 40 mK (available upon request) or 50 mK. The camera offers superior thermal imaging capabilities, thanks to the state-of-the-art microbolometer detector and on-board image processing.The Ceres V 640 camera outputs full frame images at 60 Hz via either a CameraLink or GigE Vision interface – all GenICam compliant.The compact size Ceres V 640 series offers excellent image quality and find applications in industrial machine vision, medical, scientific and security thermal imaging systems.The camera offers either a no lens configuration or with different HFOV (Horizontal Field-Of-View) options.Benefits & Features• Compact and high-resolution• Superior on-board image processing performance (optimized image quality)• GenICam compliant• Uncooled operation
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Xtium 2 CLHS PX8 LC -
Teledyne DALSA
The Xtium™ 2 CLHS PX8 features CameraLink HS standard on the PCI Express™ Gen 3.0 platform. This single cable, single slot solution supports up to 4-CLHS lanes, each operating at 10.3 Gbits/s, to acquire images at up to 5.0 GBytes/s and transfer them using PCIe x8 slots to the host memory. The Xtium2-CLHS supports Active Optical Cable (AOC) to extend the cable length beyond 100 meters. Built-in data-forwarding and multi-board sync capabilities deliver a platform for distributed processing for high-speed, computational intensive machine vision applications.
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MCLEDV4 -
Manncorp
The MCLEDV4 Pick and Place machine features four vision-equipped placement heads mounted on a high-precision, ball-screw-driven gantry for fast, accurate LED assembly on rigid LED tube boards up to 47"/1.2 meters long, circular LED bulb boards and flexible LED strips. MCLEDV4 handles standard and irregularly shaped LEDs, including domed LEDs, from 0.6 x 0.3 mm to 8 x 8 mm (20 x 20 mm available with optional bottom vision). Special tape feeders with brushless motors hold up under round-the-clock production.
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Applied Image, Inc.
With the amount of applications that optical components have, no one could hope to have the perfect component for every possible scenario. For this reason, APPLIED IMAGE makes easy the process of designing, building, and delivering custom components to our customers. Our engineering process is designed to produce the best parts in the industry and more importantly, the best component for your specific needs. The APPLIED IMAGE experience will cover the project with expert engineers from start to finish. Use the form below to start the conversation for checkerboard and dot arrays, stage and image analysis micrometers, reticles and machine vision components.
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Lt545R -
Teledyne Lumenera
The Lt545R camera uses the high performance global shutter CMOS IMX250 sensor from Sony for optimal image output while operating at very fast frame rates. The Lt545R provides the fastest full resolution images possible from the Sony Pregius® sensors when coupled with Lumenera's proven and reliable USB 3.1 Gen 1 technology. Image captures can be synchronized using either a hardware or software trigger. FPGA enabled performance, complemented by onboard memory for frame buffering, ensure dependable and reliable image delivery even in the most demanding machine vision systems.
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Ceres V 1280 Series -
Xenics
The Ceres V 1280 series is based upon the Dione 1280 OEM thermal imaging core with 1280×1024 pixels and 12 µm pixel pitch and NETD of less than 40 mK (available upon request) or 50 mK. The camera offers superior thermal imaging capabilities, thanks to the state-of-the-art microbolometer detector and on-board image processing.The Ceres V 1280 camera outputs full frame images at 60 Hz via either a CameraLink or at 45 Hz via a GigE Vision interface – all GenICam compliant.The compact size Ceres V 1280 series offers excellent image quality and find applications in industrial machine vision, medical, scientific and security thermal imaging systems.The camera offers either a no lens configuration or with different HFOV (Horizontal Field-Of-View) options.Benefits & Features• Compact and high-resolution• Superior on-board image processing performance (optimized image quality)• GenICam compliant• Uncooled operation
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eBOX671-521-FL -
Axiomtek Co., Ltd.
The eBOX671-521-FL is a GPU computing embedded system that comes with 4-CH PoE and MXM 3.1 Type A slot for applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things. The outstanding eBOX671-521-FL with enhanced GPU computing performance is powered by the 9th/8th gen Intel® Core™ i7/i5/i3 processor with up to six-core, Intel® Pentium® processor, or Intel® Celeron® processor and comes with Intel® Q370 or optional Intel® C246 chipset. The fanless embedded GPU-based system is equipped with dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display. Furthermore, this Intel® Coffee Lake-based embedded box PC is specially designed with four Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports with a total power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors. It comes in great expansion possibilities, including one internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots. For storage, it has two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature. Besides, we have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.
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Linea SWIR -
Teledyne DALSA
Teledyne DALSA’s short-wave infrared (SWIR) GigE line scan camera features a cutting-edge InGaAs sensor in a compact package for a wide variety of machine vision applications.This high speed, high resolution camera is the first product in DALSA’s SWIR family. Linea SWIR features a cutting-edge InGaAs sensor in a compact package that is suitable for a wide variety of applications. With exceptional responsivity and low noise, this camera allows customers to see their products like never before. Linea SWIR is available as a 1k resolution camera with highly responsive 12.5 µm pixels, or a 512 resolution camera with larger 25 µm pixels
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4100H -
TUV Rheinland Inc
HinaLea’s Model 4100H is an award-winning hyperspectral imaging camera with a built-in illumination source. It is recognized as the world’s first high-resolution, handheld, autonomous hyperspectral camera and that was awarded the SPIE Best Camera and Imager Prism Award in 2017. The Model 4100H is compact, lightweight and designed for field and factory use. It captures a high-resolution snap-shot image of an object, with spectra at each pixel for the visible (400 – 1000 nm) wavelength range in up to 550 bands. It features a color touch screen interface, battery operation and embedded object identification. It is ideal for medical imaging, precision agriculture, industrial machine vision and food and other quality inspection applications.
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Lt1265R -
Teledyne Lumenera
The Lt1265R USB 3.1 Gen 1 camera builds on leading edge EXview HAD II technology to deliver high sensitivity, low noise and high dynamic range. High-grade electronics ensure clear, sharp and low noise images that render details with amazing accuracy. Superior responsivity up to 1000nm positions it as a good choice for Near-Infrared (NIR) imaging. This industrial-grade camera is ideally suited for a variety of applications including unmanned vehicles, surveillance, traffic, tolling, high-speed inspection and machine vision. A scientific-grade variant is available for the most demanding life science applications such as ophthalmology and fluorescence. The Lt1265R can also be customized to suit OEM designs.
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Lt-C/M2450 -
Teledyne Lumenera
The Lt-C/M2450 camera uses the high performance global shutter CMOS IMX250 sensor from Sony for optimal image output while operating at very fast frame rates. The Lt-C/M2450 provides the fastest full resolution images possible from the Sony Pregius® sensors when coupled with Teledyne Lumenera's proven and reliable USB 3.1 Gen 1 technology. Image captures can be synchronized using either a hardware or software trigger. FPGA enabled performance, complemented by onboard memory for frame buffering, ensure dependable and reliable image delivery even in the most demanding machine vision systems.
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781699-01 -
NI
Base-, Medium-, Full-Configuration Camera Link PXI Frame Grabber Module—The PXIe‑1435 is a Camera Link image acquisition device designed for machine vision and scientific imaging applications that require high data throughput. The PXIe‑1435 works with any base‑, medium‑, and full‑configuration Camera Link camera, and it is ideal for many industrial, life science, and biomedical imaging applications. The PXIe‑1435 also supports Power over Camera Link (PoCL) and can power cameras through PoCL‑enabled cables. The onboard digital I/O includes four TTL, two optoisolated inputs, and one quadrature encoder.
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Lt665R -
Teledyne Lumenera
The Lt665R builds on EXview HAD II CCD Quad Tap sensor technology to deliver high quality imaging and high sensitivity in a compact camera rich in features. Low noise electronics ensure clear and sharp images rendering details with amazing accuracy. Its superior responsiveness positions it as a good choice for Near-Infrared (NIR) imaging. This camera is ideal for applications where high speed, sensitivity and resolution are critical including traffic, tolling, ophthalmology, life sciences, metrology, high-speed inspection, machine vision and NIR applications. A scientific-grade variant is available for the most demanding life science applications. The Lt665R can also be customized to suit OEM designs.
